MEMSolver - MEMS Software - Table of contents

Mechanics

Structures
- Beams
  - Cantilever
    - End loading - Cantilever beam with a point force at the free end
    - Distributed load - Bending of a cantilever beam under its own weight
    - Mass at free end - Bending of a cantilever beam with a mass at the free end
      - Acceleration load - Cantilever with end mass under acceleration
  - Clamped beam
    - Center loading - Bending of a beam clamped at both ends with a center force
    - Distributed load - Bending of a double clamped beam due to its weight
    - Central mass
      - Distributed load - Bending of a double-clamped beam with a central mass
      - Acceleration load - Double-clamped beam with a central mass
    - Buckling stress - Buckling of a double clamped beam
  - Bent Beam - Design of a corner beam or bent beam suspension
  - Folded beam - Design of a folded beam suspension for planar motion
  - Serpentine beam - Design of a serpentine beam suspension
  - Torsion bar - Design of a torsion bar beam suspension
  - Guided beam - Design of a guided beam hammock suspension - guidbeam
  - Crab leg flexure - Design of a crab leg suspension - crableg
  - Folded flexure - Design of a folded flexure suspension - flexure
- Diaphragms
  - Square diaphragm - Stress and deflection of a square diaphragm under pressure
  - Round diaphragm - Stress and deflection of a round diaphragm under pressure
    - Bossed diaphragm - Stress and deflection of a bossed round diaphragm
  - Rectangular diaphragm - Stress and deflection of a rectangular diaphragm
Vibration
- Free vibration
  - Cantilever
    - Cantilever beam - Free vibration frequency of a cantilever beam
    - Mass at free end - Vibration frequency of a cantilever beam with an end mass
  - Clamped beam
    - Clamped beam - Free vibration frequency of a double-clamped beam
    - Central mass - Vibration frequency of a clamped beam with a central mass
    - With axial force - Resonant frequency of a clamped beam with axial force
  - Diaphragms
    - Square diaphragm - Vibration frequency of a square diaphragm
    - Round diaphragm - Vibration frequency of a round diaphragm
  - Bent beam - Vibration frequency of a bent beam suspension
  - Folded beam - Vibration frequency of a folded beam suspension
  - Serpentine beam - Vibration frequency of a serpentine beam suspension
  - With damping - Free vibration with damping
- Forced vibration
  - Constant force - Forced vibration under a constant force with damping
  - Harmonic force - Forced vibration under a harmonic force with damping
  - Base excitation - Forced vibration driven by base excitation with damping
Damping
- Squeeze film
  - Cantilever - Squeeze film damping of a cantilever beam
  - Suspended mass - Squeeze film damping of a beam-mass microsuspension
  - Perforated mass - Squeeze film damping of suspended perforated mass
- Slide film
  - Suspended mass - Slide film damping of a suspended mass
Fluidics
- Microchannels
  - No Slip
    - Circle - Design of a circular microfluidic channel
    - Square - Design of a microfluidic channel with square cross section
    - Rectangle -Design of a microfluidic channel with rectangular crosssection
    - Triangle - Design of a microfluidic channel with triangular cross section
    - Parabola - Design of a microfluidic channel with parabolic cross section
  - With Slip
    - Rectangle - Fluid flow in a wide rectangular channel with slip
- Diffusion
  - Diffusion coefficient - Estimate diffusion coefficient of spherical bodies in a solvent
  - Spreading
    - Resting fluid - Diffusion of molecules in a resting fluid
    - Moving fluid - Taylor dispersion in microfluidic channels
  - Mixing
    - T-mixer - Design of a T-shaped microfluidic mixer
  - Separation
    - H-filter - Separation of solutes using H-filter

Sensing

Piezoresistive
- Pressure
  - Square diaphragm - Piezoresistive pressure sensor with a square diaphragm
  - Round diaphragm - Piezoresistive pressure sensor with a round diaphragm
    - Bossed diaphragm - Piezoresistive pressure sensor with round bossed diaphragm
  - Rectangular diaphragm - Piezoresistive pressure sensor with a rectangular diaphragm
Capacitive
- Acceleration
  - Static signal - Capacitive accelerometer for sensing a static signal
  - Step signal - Capacitive accelerometer for sensing a step signal
  - Pulse signal - Capacitive accelerometer for sensing a pulse signal
Piezoelectric
- Acceleration
  - Inertial mass - Piezoelectric accelerometer under longitudinal load
  - Thin film - Thin film based piezoelectric accelerometer

Actuation

Electrostatic
- Normal motion - Electrostatic parallel plate actuator for normal motion
- Torsional motion - Torsion bar actuator for torsional motion
- Lateral motion - Electrostatic comb drive actuator for lateral motion
Thermal
- Bimetallic - Design of a cantilever based bimetallic thermal actuator
- Bimorph - Design of a thermal bimorph actuator
- Bent beam - Design of a thermal bent beam actuator - chevron
Piezoelectric
- Longitudinal - Design of a longitudinal piezoelectric actuator
- Transverse - Design of a transverse piezoelectric actuator

Process

Lithography
- Spin resist - Spin coating of a thin film of photoresist
Oxidation
- Oxidation time - Calculate oxidation time to grow Silicon Dioxide
Diffusion
- Diffusion - Diffusion profile for pre-deposition and drive-in in silicon
- Diffusion mask - Silicon dioxide mask for high temperature diffusion
Implantation
- Implantation - Ion implantation and drive-in of dopants in silicon
- Implant mask - Mask thickness for selective implantation of dopants
Film Deposition
- Film stress - Thin film stress calculated from wafer bow measurements
- Metal
  - Evaporation - Deposition rate of metals using E-beam planetary evaporator
- Polysilicon - Deposition rate of polysilicon using silane in a low pressure reactor
Wet etching
- KOH etching - Etch rate of silicon and silicon dioxide in KOH
  - Membrane etch - Determine size of mask opening for membrane etch using KOH
- Phosphoric acid - Etch rate of silicon nitride and silicon dioxide in phosphoric acid
- Buffered HF - Etch rate of thermal oxide in buffered hydrofluoric acid (BOE)

Data Analysis

Unit conversion
- Pressure - Unit conversion for pressure
- Temperature - Unit conversion for temperature
- Angle - Unit conversion for angle
- Distance - Unit conversion for distance
- Force - Unit conversion for force
- Acceleration - Unit conversion for acceleration
Die calculator - Calculate gross and net die per wafer and yield
Material properties - Material property of commonly used MEMS materials