Welcome to MEMSolver documentation

This documentation provides all the information needed to make full use of this software. It gives a general overview of the software, how to access the help files, table of contents and a tutorial that explains the design interface and its functions.

General overview of MEMSolver

MEMSolver is a powerful yet simple design and analysis tool for researchers, engineers and students working in the field of Micro Electro Mechanical Systems or MEMS. Unlike some numerical analysis and finite element analysis software which require extensive programming skills and knowledge of the system to create a successful model, MEMSolver has ready made models and its associated mathematics wrapped up into one.

In most cases the physics behind the behavior of MEMS devices can be expressed by mathematical expressions. MEMSolver works by creating a mathematical model of the system and generates analytical solutions to explain the behavior of the MEMS device. The user just has to enter the physical parameters like length and width of the beam for example in a user friendly GUI, and the software will immediately calculate the relevant results and plot graphs that fully explain the MEMS device or part of it.

The software is divided into five modules namely mechanics, sensing, actuation, process and data analysis. Mechanics module is subdivided into four sub sections. The first subsection being structures where the most commonly used beams and diaphragm designs are examined. The second subsection discusses vibration of these structures both free and forced vibrations. The third subsection discusses damping in the form of squeeze film and slide film damping. The fourth subsection covers microfluidics which includes design of microfluidic channels and diffusion. Sensing module discusses sensing schemes widely used in MEMS namely piezoresistive, capacitive and piezoelectric sensing for designing pressure sensors and accelerometers. Actuation module examines the three widely used means of actuation namely electrostatic, thermal and piezoelectric actuation applied to some commonly used actuators. Process module is divided into six subsections namely lithography, oxidation, diffusion, implantation, film deposition and wet etching. This covers some of the most commonly used processes used in the development of MEMS devices. The data analysis module has a die calculator, unit conversion tool and lists the material properties of commonly used MEMS materials.

Understanding help files

Help files are HTML based web pages compressed into .chm file format. It is well indexed for ease of navigation and back reference. It will provide details on the command name that identifies the design interface, input parameters required, some theory background along with some notes on the generated output and graphs, assumptions used in the model generation and the menu path for accessing the design form.

Accessing help files

When a design window is open, pressing key F1 or pushing the toolbar button with image will open up the help file for that particular design interface.  Also help can be accessed from the main menu under Help > Help. If no design window is open, then the table of contents (TOC) page corresponding to the parent tree will be shown by default. All available sub help files will be hyperlinked from this page.

Table of Contents

The software is divided into modules, sections and topics. There are five modules namely mechanics, sensing, actuation, process and data analysis. Each module is divided into sections which is further divided into topics. Every topic has a corresponding help file which will be hyperlinked. The topic title and command name are also listed here.

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