This documentation provides all the information needed to make full use of this software. It gives a general overview of the software, how to access the help files, table of contents and a tutorial that explains the design interface and its functions.

MEMSolver is a powerful yet simple design and analysis tool for researchers, engineers and students working in the field of Micro Electro Mechanical Systems or MEMS. Unlike some numerical analysis and finite element analysis software which require extensive programming skills and knowledge of the system to create a successful model, MEMSolver has ready made models and its associated mathematics wrapped up into one.

In most cases the physics behind the behavior of MEMS devices can be expressed by mathematical expressions. MEMSolver works by creating a mathematical model of the system and generates analytical solutions to explain the behavior of the MEMS device. The user just has to enter the physical parameters like length and width of the beam for example in a user friendly GUI, and the software will immediately calculate the relevant results and plot graphs that fully explain the MEMS device or part of it.

The software is divided into five modules namely mechanics, sensing, actuation, process and data analysis. Mechanics module is subdivided into four sub sections. The first subsection being structures where the most commonly used beams and diaphragm designs are examined. The second subsection discusses vibration of these structures both free and forced vibrations. The third subsection discusses damping in the form of squeeze film and slide film damping. The fourth subsection covers microfluidics which includes design of microfluidic channels and diffusion. Sensing module discusses sensing schemes widely used in MEMS namely piezoresistive, capacitive and piezoelectric sensing for designing pressure sensors and accelerometers. Actuation module examines the three widely used means of actuation namely electrostatic, thermal and piezoelectric actuation applied to some commonly used actuators. Process module is divided into six subsections namely lithography, oxidation, diffusion, implantation, film deposition and wet etching. This covers some of the most commonly used processes used in the development of MEMS devices. The data analysis module has a die calculator, unit conversion tool and lists the material properties of commonly used MEMS materials.

**Understanding help files**

Help files are HTML based web pages compressed into .chm file
format. It is well indexed for ease of navigation and back
reference. It will provide details on the command name that
identifies the design interface, input parameters required, some
theory background along with some notes on the generated output and
graphs, assumptions used in the model generation and the menu path
for accessing the design form.

When a design window is open, pressing key F1 or pushing the toolbar button with image will open up the help file for that particular design interface. Also help can be accessed from the main menu under Help > Help. If no design window is open, then the table of contents (TOC) page corresponding to the parent tree will be shown by default. All available sub help files will be hyperlinked from this page.

The software is divided into modules, sections and topics. There are five modules namely mechanics, sensing, actuation, process and data analysis. Each module is divided into sections which is further divided into topics. Every topic has a corresponding help file which will be hyperlinked. The topic title and command name are also listed here.

- Mechanics
- Structures
**Beams****Cantilever**- End loading - Cantilever beam with a point force at the free end - frcant
- Distributed load - Bending of a cantilever beam under its own weight - wgcant
- Mass at free end - Bending of a
cantilever beam with a mass attached to the free end - mascant
- Acceleration load - Cantilever with end mass under acceleration - maclcant

**Clamped beam**- Center loading - Bending of a beam clamped at both ends with a force at the center - frclamp
- Distributed load - Bending of a double clamped beam due to its weight - wgclamp
**Central mass**- Distributed load - Bending of a double-clamped beam with a central mass - clpmass
- Acceleration load - Double-clamped beam with a central mass under acceleration - maclamp

- Buckling stress - Buckling of a double clamped beam - buckle

- Bent Beam - Design of a corner beam or bent beam suspension - bentbeam
- Folded beam - Design of a folded beam suspension for planar motion - foldbeam
- Serpentine beam - Design of a serpentine beam suspension - serpbeam
- Torsion bar - Design of a torsion bar beam suspension - torbar

**Diaphragms**- Square diaphragm - Stress and deflection of a square diaphragm under pressure - sqrdia
- Round diaphragm - Stress and
deflection of a round diaphragm under pressure - rnddia
- Bossed diaphragm - Stress and deflection of a bossed round diaphragm under pressure - bossdia

- Rectangular diaphragm - Stress and deflection of a rectangular diaphragm under pressure - rctdia

- Vibration
**Free vibration****Cantilever**- Cantilever beam - Free vibration frequency of a cantilever beam - cantfreq
- Mass at free end - Vibration frequency of a cantilever beam with an end mass - masfreq

**Clamped beam**- Clamped beam - Free vibration frequency of a double-clamped beam - clmpfreq
- Central mass - Vibration frequency of a clamped beam with a central mass - cntlmass
- With axial force - Resonant frequency of a clamped beam with axial force - frshift

**Diaphragms**- Square diaphragm - Vibration frequency of a square diaphragm - sqdfrq
- Round diaphragm - Vibration frequency of a round diaphragm - rndfrq

- Bent beam - Vibration frequency of a bent beam suspension - bntfrq
- Folded beam - Vibration frequency of a folded beam suspension - fldfrq
- Serpentine beam - Vibration frequency of a serpentine beam suspension - srpfrq
- With damping - Free vibration with damping - frvdmp

**Forced vibration**- Constant force - Forced vibration under a constant force with damping - fcvstp
- Harmonic force - Forced vibration under a harmonic force with damping - fcvhrm
- Base excitation - Forced vibration driven by base excitation with damping - fcvbase

- Damping
**Squeeze film**- Cantilever - Squeeze film damping of a cantilever beam - sqdcant
- Suspended mass - Squeeze film damping of a beam-mass microsuspension - sqdsus
- Perforated mass - Squeeze film damping of suspended perforated mass - sqdper

**Slide film**- Suspended mass - Slide film damping of a suspended mass - sldsus

- Fluidics
**Microchannels****No Slip**- Circle - Design of a circular microfluidic channel - circhn
- Square - Design of a microfluidic channel with square cross section - sqrchn
- Rectangle - Design of a microfluidic channel with rectangular cross section - retchn
- Triangle - Design of a microfluidic channel with triangular cross section - trgchn
- Parabola - Design of a microfluidic channel with parabolic cross section - parchn

**With Slip**- Rectangle - Fluid flow in a wide rectangular channel with slip - slipflo

**Diffusion**- Diffusion coefficient - Estimate diffusion coefficient of spherical bodies in a solvent - dcoef
**Spreading**- Resting fluid - Diffusion of molecules in a resting fluid - spread
- Moving fluid - Taylor dispersion in
microfluidic channels - taylor

**Mixing**- T-mixer - Design of a T-shaped microfluidic mixer - tmixer

**Separation**- H-filter - Separation of solutes using H-filter - hfilter

- Structures

- Sensing
- Piezoresistive
**Pressure**- Square diaphragm - Piezoresistive pressure sensor with a square diaphragm - sqrmem
- Round diaphragm - Piezoresistive
pressure sensor with a round diaphragm - rndmem
- Bossed diaphragm - Piezoresistive pressure sensor with a round bossed diaphragm - bosmem

- Rectangular diaphragm - Piezoresistive pressure sensor with a rectangular diaphragm - rctmem

- Capacitive
**Acceleration**- Static signal - Capacitive accelerometer for sensing a static signal - aclstat
- Step signal - Capacitive accelerometer for sensing a step signal - aclstep
- Pulse signal - Capacitive accelerometer for sensing a pulse signal - aclpulse

- Piezoelectric
**Acceleration**- Inertial mass - Piezoelectric accelerometer under longitudinal load - pizoacel
- Thin film - Thin film based piezoelectric accelerometer - pizofilm

- Piezoresistive

- Actuation
- Electrostatic
- Normal motion - Electrostatic parallel plate actuator for normal motion - pplate
- Torsional motion - Torsion bar actuator for torsional motion - toract
- Lateral motion - Electrostatic comb drive actuator for lateral motion - combdr

- Thermal
- Bimetallic - Design of a cantilever based bimetallic thermal actuator - bimetal
- Bimorph - Design of a thermal bimorph actuator - bimorf
- Bent beam - Design of a thermal bent beam actuator - chevron

- Piezoelectric
- Longitudinal - Longitudinal piezoelectric actuator - pizoact
- Transverse - Transverse piezoelectric actuator - pizotrac

- Electrostatic

- Process
- Lithography
- Spin resist - Spin coating of a thin film of photoresist - sresist

- Oxidation
- Oxidation time - Calculate oxidation time to grow Silicon Dioxide - oxidize

- Diffusion
- Diffusion - Diffusion profile for pre-deposition and drive-in in silicon - diffuse
- Diffusion mask - Silicon dioxide mask for high temperature diffusion - oxmask

- Implantation
- Implantation - Ion implantation and drive-in of dopants in silicon - implant
- Implant mask - Mask thickness for selective implantation of dopants - impmask

- Film Deposition
- Film stress - Thin film stress calculated from wafer bow measurements -wfrbow
**Metal**- Evaporation - Deposition rate of metals using E-beam planetary evaporator -evap

- Polysilicon - Deposition rate of polysilicon using silane in a low pressure reactor - polysi

- Wet etching
- KOH etching - Etch rate of silicon
and silicon dioxide in KOH - kohetch
- Membrane etch - Determine size of mask opening for membrane etch using KOH - memetch

- Phosphoric acid - Etch rate of silicon nitride and silicon dioxide in phosphoric acid - nitetch
- Buffered HF - Etch rate of thermal oxide in buffered hydrofluoric acid (BOE) - oxyetch

- KOH etching - Etch rate of silicon
and silicon dioxide in KOH - kohetch

- Lithography

- Data
Analysis
- Unit conversion
- Pressure - Unit conversion for pressure - convert
- Temperature - Unit conversion for temperature- convert
- Angle - Unit conversion for angle - convert
- Distance - Unit conversion for distance - convert
- Force - Unit conversion for force - convert
- Acceleration - Unit conversion for acceleration - convert

- Die calculator - Calculate gross and net die per wafer and yield - yield
- Material properties - Material property of commonly used MEMS materials - matpro

- Unit conversion